Taiwan Semiconductor Material Ceramic-Lined Ball Mill Grinding Project

Project Background and Challenges

Client: A well-known upstream semiconductor material manufacturer in Taiwan.
Project Requirement:
The client needed to grind high-purity electronic-grade ceramic powder for semiconductor packaging and sputtering targets. The target was micron or even submicron-level particle size.

Core Challenges:

• Extremely High Purity Requirements:
  Semiconductor materials have an extremely low tolerance for metallic impurities such as Fe and Cr.
  Traditional steel-lined ball mills risk severe iron contamination, making them unsuitable for this application.
• Fineness and Efficiency:
  The system must ensure precise particle fineness while maintaining stable and efficient batch production.

Solution

To meet the customer’s stringent requirements for purity and ultrafine particle size, EPIC POWDER designed a custom ceramic-lined ball mill grinding system.

• Liner Material:
  All components that contact the material are made from high-purity, wear-resistant zirconia ceramic. These include the mill cylinder, agitator shaft, and screening parts. This design completely eliminates the risk of Fe or Cr contamination.
• Grinding Media:
  The system uses high-purity, micron-sized zirconia beads as the grinding media, ensuring no secondary contamination even under long-term high-energy milling.
• Precision Classification:
  Equipped with frequency control and a high-efficiency classifier, the system achieves a consistent particle size of D97 = 2–5 μm.
• Closed System Design:
  The entire production line operates in a fully enclosed system, effectively preventing dust dispersion and external contamination.

Project Outcome

This customized solution helped the Taiwanese client overcome the bottleneck in high-purity powder production, significantly improving product consistency and purity.
As a result, the client strengthened its position within the semiconductor upstream material supply chain, achieving both technological and quality advantages.

Material :semiconductor material

Fineness: D97 = 2–5 μm

Output: 1.5-2T /h